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Multilayer varistors (MLVs)
Automotive series
Profile feature
Preheat and soak
Sn-Pb eutectic assembly
Pb-free assembly
Time (t P ) within 5 ° C of specified
- Temperature min
- Temperature max
- Time
Average ramp-up rate
Liquidous temperature
Time at liquidous
Peak package body temperature
3)
classification temperature (T c )
Average ramp-down rate
Time 25 ° C to peak temperature
T smin
T smax
t smin to t smax
T smax to T p
T L
t L
T p1)
T p to T smax
100 ° C
150 ° C
60 ... 120 s
3 ° C/ s max.
183 ° C
60 ... 150 s
220 ° C ... 235 ° C 2)
20 s 3)
6 ° C/ s max.
maximum 6 min
150 ° C
200 ° C
60 ... 180 s
3 ° C/ s max.
217 ° C
60 ... 150 s
245 ° C ... 260 ° C 2)
30 s 3)
6 ° C/ s max.
maximum 8 min
1) Tolerance for peak profile temperature (T P ) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (t P ) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
2.2
Wave soldering temperature profile
Temperature characteristics at component terminal with dual-wave soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 59 of 72
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